Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081442 | Low cost metallization during fabrication of an integrated circuit (IC) | Boris Gedzberg, Ronald L. Michels | 2021-08-03 |
| 10461025 | Low cost metallization during fabrication of an integrated circuit (IC) | Boris Gedzberg, Ronald L. Michels | 2019-10-29 |
| 10347591 | Metallic, tunable thin film stress compensation for epitaxial wafers | Jeffrey Bellotti | 2019-07-09 |
| 10199324 | Low cost metallization during fabrication of an integrated circuit (IC) | Boris Gedzberg, Ron Michels | 2019-02-05 |
| 7718486 | Structures and methods for fabricating vertically integrated HBT-FET device | Oleh Krutko, Kezhou Xie, Aditya Gupta, Boris Gedzberg | 2010-05-18 |
| 7015519 | Structures and methods for fabricating vertically integrated HBT/FET device | Oleh Krutko, Kezhou Xie, Aditya Gupta, Boris Gedzberg | 2006-03-21 |