Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308341 | Wire bond capillary design | — | 2025-05-20 |
| 12087728 | Systems and methods related to wire bond cleaning and wire bonding recovery | Aldrin Quinones GARING | 2024-09-10 |
| 11701739 | Method of optimizing laser cutting of wafers for producing integrated circuit dies | Juan Arturo Jerez, Luis Enrique Velazquez Cardenas | 2023-07-18 |
| 11616045 | Methods and apparatuses for removal of wires from packaging substrates | Cesar Melendrez, Aldrin Quinones GARING | 2023-03-28 |
| 11302669 | Wire bond cleaning method and wire bonding recovery process | Aldrin Quinones GARING | 2022-04-12 |