Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10982322 | Methods to improve front-side process uniformity by back-side metallization | — | 2021-04-20 |
| 10971418 | Packaging structures with improved adhesion and strength | Bradley Paul Barber | 2021-04-06 |
| 10840114 | Rapid thermal anneal apparatus and method | Christopher J. MacDonald, Kamal Tabatabaie Alavi, Adrian D. Williams | 2020-11-17 |
| 10541148 | Method for controlling the amount of radiation having a predetermined wavelength to be absorbed by a structure disposed on a semiconductor | Kamal Tabatabaie Alavi, Adrian D. Williams, Christopher J. MacDonald, Kiuchul Hwang | 2020-01-21 |
| 10453763 | Packaging structures with improved adhesion and strength | Bradley Paul Barber | 2019-10-22 |
| 10439035 | Schottky contact structure for semiconductor devices and method for forming such Schottky contact structure | Kamal Tabatabaie-Alavi, Christopher J. MacDonald | 2019-10-08 |
| 10026823 | Schottky contact structure for semiconductor devices and method for forming such schottky contact structure | Kamal Tabatabaie-Alavi, Christopher J. MacDonald | 2018-07-17 |
| 9768081 | Electron radiation monitoring electrode system to prevent gold spitting and resist cross-linking during evaporation | — | 2017-09-19 |
| 9576906 | Methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure | — | 2017-02-21 |
| 9553049 | Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor | — | 2017-01-24 |
| 9443803 | Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure | — | 2016-09-13 |
| 9068918 | Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation | — | 2015-06-30 |
| 8956979 | Systems and methods for improving front-side process uniformity by back-side metallization | — | 2015-02-17 |
| 8878362 | Copper interconnects having a titanium—titanium nitride assembly between copper and compound semiconductor | — | 2014-11-04 |
| 8373427 | Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation | — | 2013-02-12 |