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John Y. Spann

ST Skorpios Technologies: 12 patents #8 of 32Top 25%
Overall (All Time): #362,930 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12287510 Integration of an unprocessed, direct-bandgap chip into a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2025-04-29
11557880 Diffusion blocking layer for a compound semiconductor structure John Zyskind 2023-01-17
11181688 Integration of an unprocessed, direct-bandgap chip into a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2021-11-23
10833480 Diffusion blocking layer for a compound semiconductor structure John Zyskind 2020-11-10
10243314 Semiconductor layer variation for substrate removal after bonding 2019-03-26
9991149 Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal Damien Lambert, Stephen B. Krasulick 2018-06-05
9923105 Processing of a direct-bandgap chip after bonding to a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2018-03-20
9882073 Structures for bonding a direct-bandgap chip to a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2018-01-30
9568750 Hybrid optical modulator Derek Van Orden, Amit Mizrahi, Timothy Creazzo, Elton Marchena, Robert J. Stone +1 more 2017-02-14
9496431 Coplanar integration of a direct-bandgap chip into a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2016-11-15
9324682 Method and system for height registration during chip bonding Elton Marchena, Timothy Creazzo, Stephen B. Krasulick, Amit Mizrahi 2016-04-26
9316785 Integration of an unprocessed, direct-bandgap chip into a silicon photonic device Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena 2016-04-19
9209142 Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal Damien Lambert, Stephen B. Krasulick 2015-12-08