Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811116 | Semiconductor systems | Woongrae Kim | 2020-10-20 |
| 10706899 | Semiconductor device | Woongrae Kim | 2020-07-07 |
| 10559340 | Semiconductor device | Woongrae Kim | 2020-02-11 |
| 10497411 | Semiconductor device | Woongrae Kim | 2019-12-03 |
| 10366732 | Semiconductor device | Woongrae Kim | 2019-07-30 |
| 10290361 | Semiconductor systems | Woongrae Kim | 2019-05-14 |
| 8304922 | Semiconductor package system with thermal die bonding | Tae Keun Lee | 2012-11-06 |
| 8030755 | Integrated circuit package system with a heat sink | Tae Keun Lee | 2011-10-04 |
| 8003497 | Diluted magnetic semiconductor nanowires exhibiting magnetoresistance | Peidong Yang, Heonjin Choi, Rongrui He, Yanfeng Zhang, Tevye Kuykendal +1 more | 2011-08-23 |
| 7714451 | Semiconductor package system with thermal die bonding | Tae Keun Lee | 2010-05-11 |