Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288761 | Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same | Jun Yong Song, Si Yun KIM | 2025-04-29 |
| 12237251 | Semiconductor package including connection pad including groove pattern | Si Yun KIM, Jun Yong Song | 2025-02-25 |
| 12002783 | Methods of manufacturing semiconductor device with bump interconnection | Jun Yong Song, Si Yun KIM | 2024-06-04 |