Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322475 | Stack semiconductor packages having wire-bonding connection structure | Jae-Hoon Lee | 2022-05-03 |
| 10998281 | Semiconductor packages | Jae-Hoon Lee, Sun Kyu KONG | 2021-05-04 |