Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710728 | Memory device having wafer-to-wafer bonding structure | Sung Lae OH, Soo Yeol CHAI | 2023-07-25 |
| 11373701 | Semiconductor device | Sang Hyun SUNG, Sung Lae OH | 2022-06-28 |
| 11282819 | Semiconductor device having chip-to-chip bonding structure | Sung Lae OH, Sang Hyun SUNG, Kwang Hwi Park | 2022-03-22 |
| 10062765 | Nonvolatile memory device including multiple planes | Sung Lae OH, Dong Hyuk Kim, Soo-Nam Jung | 2018-08-28 |