Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002851 | Semiconductor packages including chip enablement pads | Ki-Yong Lee, Sang Hwan Kim | 2018-06-19 |
| 9875990 | Semiconductor package including planar stacked semiconductor chips | Ki-Yong Lee, Jong Hyun Kim, Hyoung Min IM | 2018-01-23 |
| 9589905 | EMI shielding in semiconductor packages | Jong Hyun Kim | 2017-03-07 |
| 9508683 | Semiconductor packages and methods for manufacturing the same | — | 2016-11-29 |
| 9502378 | Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same | Ki-Yong Lee, Jong Hyun Kim | 2016-11-22 |
| 9275959 | Semiconductor packages having EMI shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same | Jong Hyun Kim | 2016-03-01 |
| 9184140 | Semiconductor packages having emi shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same | Jong Hyun Kim | 2015-11-10 |
| 8736075 | Semiconductor chip module, semiconductor package having the same and package module | Mun Aun Hyun, Jong Hyun Kim, Hyeon Ji Baek | 2014-05-27 |