Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021515 | Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip | Ju-il Eom, Woo Jin Lee | 2024-06-25 |
| 11715708 | Semiconductor package including decoupling capacitor | Jae-Hoon Lee | 2023-08-01 |
| 11682643 | Semiconductor chip having chip pads of different surface areas, and semiconductor package including the same | Ju-il Eom, Woo Jin Lee | 2023-06-20 |
| 11183470 | Semiconductor package including decoupling capacitor | Jae-Hoon Lee | 2021-11-23 |
| 9953965 | Semiconductor package | Gi Guk Park, Tae Lim Song | 2018-04-24 |