Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334470 | Chip packaging structure and related inner lead bonding method | Ying-Chen Chang, Kuo-Wei Tseng | 2025-06-17 |
| 11694983 | Test pad structure of chip | Kuo-Wei Tseng | 2023-07-04 |
| 11217508 | Lead structure of circuit with increased gaps between adjacent leads | Kuo-Wei Tseng, Jui-Hsuan Cheng | 2022-01-04 |
| 10163769 | Manufacturing method for electronic element | Kuo-Wei Tseng | 2018-12-25 |
| 9773746 | Electronic element and manufacturing method | Kuo-Wei Tseng | 2017-09-26 |