Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10613145 | Configuration and testing method and system for FPGA chip using bumping process | Bin Luo, Hua Wang, Xuefei Tang, Jianbo Ling, Jianming Ye | 2020-04-07 |
| 8878545 | Test apparatus with physical separation feature | Jie Zhang, Zhiyong Zhang, Jianhua Qi | 2014-11-04 |