Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853692 | Test structure and method for bond pad quality monitoring | Boon Leng Lim | 2014-10-07 |
| 7342766 | On-chip capacitor | — | 2008-03-11 |
| 7262608 | Via etch monitoring | Kandasamy Sundaram, Rajagopal Ramakrishnan, Arjun Kumar | 2007-08-28 |