Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334456 | Electronic package and manufacturing method thereof | Chung-Yu Ke | 2025-06-17 |
| 12308308 | Electronic package | Sung-Hua Chung | 2025-05-20 |
| 12113004 | Electronic package and manufacturing method thereof | Chung-Yu Ke, Po-Kai Huang | 2024-10-08 |
| 12057618 | Electronic package and fabrication method thereof | Chung-Yu Ke, Chia-Chu Lai | 2024-08-06 |
| 11682826 | Electronic package and fabrication method thereof | Chung-Yu Ke, Chia-Chu Lai | 2023-06-20 |
| 10897810 | High speed signal fan-out method for BGA and printed circuit board using the same | Jiwei Wen, Chenxia Feng, Lijuan Qu | 2021-01-19 |