Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443994 | Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package | Cheng-Kai Chang | 2022-09-13 |
| 11143549 | Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die | Cheng-Kai Chang | 2021-10-12 |
| 10764995 | Fabrication method of substrate structure | Chun-Lung Chen | 2020-09-01 |
| 9907161 | Substrate structure and fabrication method thereof | Chun-Lung Chen | 2018-02-27 |