Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9403677 | Micro-electromechanical semiconductor component | — | 2016-08-02 |
| 9399572 | Microelectromechanical component and method for testing a microelectromechanical component | Bernd Burchard | 2016-07-26 |
| 9013015 | Micro-electromechanical semiconductor component | — | 2015-04-21 |
| 8916944 | Stress-sensitive micro-electromechanical device and use thereof | Bernd Burchard, Zhou Ningning | 2014-12-23 |
| 8820169 | Compensation of stress effects on pressure sensor components | Richard J. August | 2014-09-02 |
| 8402835 | Compensation of stress effects on pressure sensor components | Richard J. August | 2013-03-26 |
| 8132465 | Sensor element placement for package stress compensation | Joachim Bergmann | 2012-03-13 |
| 8082796 | Temperature extraction from a pressure sensor | — | 2011-12-27 |
| 7567663 | Telephone call processing | Thomas Hasenfratz | 2009-07-28 |