Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10333019 | Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same | Jiaming Ye | 2019-06-25 |
| 9508677 | Chip package assembly and manufacturing method thereof | Jiaming Ye | 2016-11-29 |