Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11781048 | One-component thermosetting epoxy adhesive with improved adhesion | Geng Lin | 2023-10-10 |
| 10836881 | Pumpable and thermally expandable filler compositions | Geng Lin, Steve Davis | 2020-11-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11781048 | One-component thermosetting epoxy adhesive with improved adhesion | Geng Lin | 2023-10-10 |
| 10836881 | Pumpable and thermally expandable filler compositions | Geng Lin, Steve Davis | 2020-11-17 |