Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363826 | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate | Shinichi Kamoshida, Hiroshi Kurokawa | 2025-07-15 |
| 11136454 | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board | Keisuke Kushida, Hiroshi Shimizu, Minoru Kakitani, Tatsunori Kaneko | 2021-10-05 |
| 10940674 | Resin varnish, prepreg, laminate, and printed wiring board | Minoru Kakitani, Hiroshi Shimizu, Keisuke Kushida, Tatsunori Kaneko | 2021-03-09 |