Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9078382 | Method of producing circuit board | Takashi Shoji | 2015-07-07 |
| 8752754 | Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board | Takashi Shoji | 2014-06-17 |
| 8661659 | Method of producing circuit board | Takashi Shoji | 2014-03-04 |
| 8123111 | Production method of solder circuit board | Takashi Shoji, Tetsuo Kubota | 2012-02-28 |
| 8109432 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board | Takashi Shoji, Tetsuo Kubota | 2012-02-07 |
| 8038051 | Method for production of electronic circuit board | Takashi Shoji | 2011-10-18 |
| 7775417 | Method of producing conductive circuit board | Takashi Shoji | 2010-08-17 |
| 6476487 | Solder circuit | Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji | 2002-11-05 |
| 6221692 | Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewith | Takashi Shoji | 2001-04-24 |
| 5982629 | Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith | Takashi Shoji | 1999-11-09 |
| 5928440 | Method of forming solder film | Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji | 1999-07-27 |
| 5750271 | Method of forming solder film | Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji | 1998-05-12 |
| 5713997 | Solution for selectively imparting tackiness to a metallic surface | Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji | 1998-02-03 |
| 5556023 | Method of forming solder film | Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji | 1996-09-17 |