TI

Takahide Ichimura

SC Shinko Electric Industries Co.: 1 patents #437 of 723Top 65%
Overall (All Time): #3,531,283 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6662351 Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern Tamotsu Kitamura, Hiroyuki Sakai, Takayuki Nagasaki 2003-12-09