Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9060456 | Production method of multilayer printed wiring board and multilayer printed wiring board | Seiichiro Ohashi, Eiichi Hayashi, Shigeo Nakamura, Junichi Nakamura | 2015-06-16 |
| 8533942 | Production method of multilayer printed wiring board and multilayer printed wiring board | Seiichiro Ohashi, Eiichi Hayashi, Shigeo Nakamura, Junichi Nakamura | 2013-09-17 |
| 6767616 | Metal core substrate and process for manufacturing same | Kazuhiko Ooi, Masaru Yamazaki, Yukiji Watanabe | 2004-07-27 |