Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6577000 | Premold type semiconductor package | Takeshi Sato, Hiromi Tokunaga | 2003-06-10 |
| 6333211 | Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps | Takeshi Sato, Hiromi Tokunaga | 2001-12-25 |
| 6097101 | Package for semiconductor device having frame-like molded portion and producing method of the same | Takeshi Sato, Hiromi Tokunaga | 2000-08-01 |
| 5945688 | Optical semiconductor device and lead frame used in such a device | Masataka Kasahara | 1999-08-31 |
| 4755125 | Compression molding apparatus | Hiroshi Takeda, Noritsugu Oshima, Tateo Kubo | 1988-07-05 |
| 4640673 | Compression molding apparatus | Hiroshi Takeda, Noritsugu Oshima, Tateo Kubo | 1987-02-03 |