Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9560768 | Wiring substrate and method of making wiring substrate | Yasuhiko Kusama, Hideyuki Tako, Kenji Kawai | 2017-01-31 |
| 9497863 | Wiring substrate and method of making wiring substrate | Yasuhiko Kusama, Hideyuki Tako, Kenji Kawai | 2016-11-15 |
| 8587104 | Wiring board and semiconductor package | Junji Sato | 2013-11-19 |