Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12145218 | Flux transfer apparatus | — | 2024-11-19 |
| 11749541 | Bonding apparatus | Yuji Eguchi, Kohei Seyama | 2023-09-05 |
| 7299976 | Payment apparatus and method, and money assignment apparatus and method | Yohei Nakada, Katsuya Yokomura, Toshiyuki Morita, Kunihiro Nomura, Kenji Uematsu | 2007-11-27 |