Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404353 | Electronic device, connection body, and manufacturing method for electronic device | Soichiro Umeda | 2022-08-02 |
| 11211311 | Electronic device and connection body | Soichiro Umeda | 2021-12-28 |
| 10910292 | Electronic device and connection body | Soichiro Umeda | 2021-02-02 |
| 10896868 | Electronic device and connector | Soichiro Umeda | 2021-01-19 |
| 10615092 | Electronic device | Soichiro Umeda | 2020-04-07 |
| 10600712 | Electronic device | Soichiro Umeda | 2020-03-24 |
| 10461042 | Semiconductor module | Kosuke Ikeda | 2019-10-29 |
| 10319704 | Semiconductor module | Kosuke Ikeda | 2019-06-11 |
| 10251256 | Heat dissipating structure | Kosuke Ikeda, Osamu Matsuzaki | 2019-04-02 |
| 10243477 | Semiconductor device having a bypass capacitor | Atsushi Kyutoku, Yoshihiko Kikuchi | 2019-03-26 |
| 10199486 | Semiconductor device | Atsushi Kyutoku, Yoshihiko Kikuchi | 2019-02-05 |
| 10159166 | Heat dissipating structure | Kosuke Ikeda, Osamu Matsuzaki | 2018-12-18 |
| 10083844 | Method of manufacturing bonded body | Ryo Matsubayashi | 2018-09-25 |
| 9704828 | Semiconductor module | Kosuke Ikeda, Osamu Matsuzaki | 2017-07-11 |