Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688714 | Semiconductor package with three leads | — | 2023-06-27 |
| 11515253 | Electronic module | — | 2022-11-29 |
| 11462974 | Semiconductor module | Yoshihisa Ieiri | 2022-10-04 |
| 11309274 | Electronic module | — | 2022-04-19 |
| 11227810 | Electronic module with a groove and press hole on the surface of a conductor | — | 2022-01-18 |
| 11227816 | Electronic module with press hole to expose surface of a conductor | — | 2022-01-18 |
| 11183943 | Semiconductor module | Yoshihisa Ieiri | 2021-11-23 |
| 11165363 | Electronic module | — | 2021-11-02 |
| 11145576 | Electronic module | — | 2021-10-12 |
| 11101204 | Semiconductor module | Yoshihisa Ieiri | 2021-08-24 |
| 10985092 | Semiconductor device | — | 2021-04-20 |
| 10832994 | Electronic module | — | 2020-11-10 |
| D877102 | Semiconductor module | — | 2020-03-03 |
| 10553523 | Semiconductor device | — | 2020-02-04 |
| 10490490 | Thermally conductive semiconductor device and manufacturing method thereof | — | 2019-11-26 |
| 10453779 | Semiconductor device | — | 2019-10-22 |
| 10453781 | Semiconductor device | — | 2019-10-22 |
| 10438872 | Semiconductor device and lead frame | — | 2019-10-08 |
| 10103096 | Semiconductor device | — | 2018-10-16 |
| 9966327 | Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device | Soichiro Umeda | 2018-05-08 |
| 9673143 | Semiconductor device and manufacturing method of the same | — | 2017-06-06 |