Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495488 | Method for manufacturing bonded SOI wafer and bonded SOI wafer | Toshikazu Imai, Kazuhiko Yoshida, Taishi WAKABAYASHI, Osamu Ishikawa | 2022-11-08 |
| 10763127 | Heat treatment method for semiconductor wafer | Taishi WAKABAYASHI, Kenji Meguro | 2020-09-01 |