Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091430 | Metal surface treatment liquid and liquid concentrate thereof, metal surface treatment liquid set, metal surface treatment method, and method for manufacturing printed wiring board | Noriaki Yamaji, Tatsuya Koga | 2024-09-17 |
| 11680076 | Triazole silane compound, method for synthesizing said compound and use thereof | Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato KATSUMURA, Noriaki Yamaji +2 more | 2023-06-20 |
| 11472823 | Tetrazole silane compound, method for synthesizing said compound and use thereof | Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato KATSUMURA +3 more | 2022-10-18 |
| 11014946 | Tetrazole silane compound, method for synthesizing said compound and use thereof | Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato KATSUMURA +3 more | 2021-05-25 |
| 10405422 | Copper film-forming agent and method for forming copper film | Shusaku Iida, Takayuki Murai | 2019-09-03 |
| 10398028 | Surface treating composition for copper and copper alloy and utilization thereof | Noriaki Yamaji, Masato Nakanishi, Takayuki Murai | 2019-08-27 |
| 9649713 | Surface treating composition for copper and copper alloy and utilization thereof | Noriaki Yamaji, Masato Nakanishi, Takayuki Murai | 2017-05-16 |
| 9532493 | Surface treating composition for copper and copper alloy and utilization thereof | Noriaki Yamaji, Masato Nakanishi, Takayuki Murai | 2016-12-27 |
| 8378116 | Phenylnaphthylimidazole compound and usage of the same | Yoshimasa Kikukawa, Takayuki Murai | 2013-02-19 |
| 8183386 | Phenylnaphthylimidazole compound and usage of the same | Yoshimasa Kikukawa, Takayuki Murai | 2012-05-22 |
| 7754105 | Water-soluble preflux and usage of the same | Yoshimasa Kikukawa, Takayuki Murai | 2010-07-13 |
| 7661577 | Imidazole compound and use thereof | Takayuki Murai, Yoshimasa Kikukawa | 2010-02-16 |
| 5795409 | Surface treating agent for copper or copper alloy | Yoshimasa Kikukawa | 1998-08-18 |
| 5560785 | Method for forming a protective chemical layer on copper and copper alloy surfaces | Yoshimasa Kikukawa, Toshihiro Okamoto, Takayuki Murai, Seiji Sogabe, Miya Tanioka +2 more | 1996-10-01 |
| 5498301 | Agent for treating surfaces of copper and copper alloys | Yoshimasa Kikukawa, Toshihiro Okamoto, Takayuki Murai, Seiji Sogabe, Miya Tanioka +2 more | 1996-03-12 |