Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6189591 | Wafer sheet expanding apparatus and pellet bonding apparatus using thereof | Yasushi Takeda | 2001-02-20 |
| 5516026 | Pellet bonding apparatus | Yasushi Takeda, Katsuyoshi Kawabe | 1996-05-14 |