Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545517 | Chip package structure, electronic device and method for preparing a chip package structure | — | 2023-01-03 |
| 11302621 | Chip package structure and electronic device | — | 2022-04-12 |
| 10922518 | Chip package structure, chip package method and terminal device | Ya WEI | 2021-02-16 |
| 10784298 | Optical module, fabrication method thereof, and terminal device using the same | Ya WEI, Wei Long, Baoquan WU | 2020-09-22 |
| 9934419 | Package structure, electronic device and method for manufacturing package structure | — | 2018-04-03 |