Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6147141 | Die attach adhesive compositions | Pui K. Wong | 2000-11-14 |
| 5973052 | Die attach adhesive compositions | Pui K. Wong | 1999-10-26 |
| 5912282 | Die attach adhesive compositions | Pui K. Wong | 1999-06-15 |
| 5840215 | Anisotropic conductive adhesive compositions | Pui K. Wong | 1998-11-24 |
| 5760337 | Thermally reworkable binders for flip-chip devices | Pui K. Wong | 1998-06-02 |
| 5726391 | Thermosetting Encapsulants for electronics packaging | Pui K. Wong | 1998-03-10 |
| 5478599 | Process for resin impregnation of a fibrous substrate | C. Shirrell | 1995-12-26 |
| 5128199 | Method for fiber coating with particles | Lawrence T. Drzal | 1992-07-07 |
| 5123373 | Method for fiber coating with particles | Lawrence T. Drzal, Krishnamurthy Jayaraman | 1992-06-23 |
| 5102690 | Method coating fibers with particles by fluidization in a gas | Lawrence T. Drzal, Krishnamurthy Jayaraman | 1992-04-07 |
| 5042111 | Method and system for spreading a tow of fibers | Lawrence T. Drzal | 1991-08-27 |
| 5042122 | Method and system for spreading a tow of fibers | Lawrence T. Drzal | 1991-08-27 |