Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5840402 | Metallized laminate material having ordered distribution of conductive through holes | Sidney J. Roberts, Eugene T. Selbitschka, Glenn Gengel | 1998-11-24 |
| 5615477 | Method for interconnecting a flip chip to a printed circuit substrate | — | 1997-04-01 |