Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784464 | Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding | Hideki Ichikawa, Mamoru Okanishi, Toshihiko Yoshida | 2004-08-31 |
| 6562693 | Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding | Hideki Ichikawa, Mamoru Okanishi, Toshihiko Yoshida | 2003-05-13 |
| 6142356 | Die bonding apparatus | Masao Yamazaki | 2000-11-07 |