Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5217912 | Method for manufacturing a semiconductor device | Akitsu Ayukawa, Hiroshi Ishihara | 1993-06-08 |
| 5200361 | Process for preparing a semiconductor device using hydrogen fluoride and nitrogen to remove deposits | — | 1993-04-06 |
| 5183782 | Process for fabricating a semiconductor device including a tungsten silicide adhesive layer | Tsutomu Yamadai, Kazuya Ishihara | 1993-02-02 |
| 5183770 | Semiconductor device | Akitsu Ayukawa | 1993-02-02 |
| 5139964 | Method for forming isolation region of semiconductor device | Kenichi Tanaka, Yoshimitsu Yamauchi, Keizo Sakiyama | 1992-08-18 |
| 5059550 | Method of forming an element isolating portion in a semiconductor device | Hidehisa Tateoka, Kenichi Tanaka | 1991-10-22 |
| 5049970 | High resistive element | Kenichi Tanaka, Toshiyuki Okumura, Keizo Sakiyama | 1991-09-17 |
| 4916087 | Method of manufacturing a semiconductor device by filling and planarizing narrow and wide trenches | Hidehisa Tateoka, Masato Kawai | 1990-04-10 |