Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761630 | Method for manufacturing image pickup module | — | 2017-09-12 |
| 9685478 | Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method | — | 2017-06-20 |
| 6388623 | Antenna-integrated microwave-millimeter wave module | Atsushi Yamada, Koki Kitaoka | 2002-05-14 |