Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5715806 | Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same | Tadashi Tonegawa | 1998-02-10 |