BL

Boyan LV

SC Shanghai Tianma Am-Oled Co.: 3 patents #72 of 214Top 35%
TC Tianma Microelectronics Co.: 3 patents #131 of 431Top 35%
TE Tencent: 1 patents #4,257 of 8,131Top 55%
Overall (All Time): #1,165,923 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10615365 Package assemblies and the packaging method thereof Yawei Liu 2020-04-07
10109684 Pixel element structure, array structure and display device Liyuan Luo, Dong Qian 2018-10-23
9960211 Pixel element structure, array structure and display device Liyuan Luo, Dong Qian 2018-05-01
9721999 Pixel element structure, array structure and display device Liyuan Luo, Dong Qian 2017-08-01