Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11780727 | Low-stress packaging structure for MEMS acceleration sensor chip | — | 2023-10-10 |
| 9625487 | Capacitive acceleration sensor with a bending elastic beam and preparation method thereof | Xiaofeng Zhou, Yuelin Wang | 2017-04-18 |
| 9625488 | Variable area capacitive lateral acceleration sensor and preparation method thereof | Xiaofeng Zhou, Ruojie Tao, Yuelin Wang | 2017-04-18 |
| 9476906 | Capacitive acceleration sensor with an H-shaped beam and preparation method thereof | Xiaofeng Zhou, Bin Xiong, Yuelin Wang | 2016-10-25 |