Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8467559 | Silicon microphone without dedicated backplate | — | 2013-06-18 |
| 8178936 | Double-side mountable MEMS package | Chong Ser Choong | 2012-05-15 |
| 8045733 | Silicon microphone with enhanced impact proof structure using bonding wires | Chong Ser Choong | 2011-10-25 |
| 8045734 | Backplateless silicon microphone | Miao Yubo | 2011-10-25 |
| 8013404 | Folded lead-frame packages for MEMS devices | Chong Ser Choong | 2011-09-06 |
| 7999201 | MEMS G-switch device | Xin Cao | 2011-08-16 |
| 7843021 | Double-side mountable MEMS package | Chong Ser Choong | 2010-11-30 |
| 7692288 | MEMS packaging method for enhanced EMI immunity using flexible substrates | Miao Yubo | 2010-04-06 |
| 7436054 | MEMS microphone with a stacked PCB package and method of producing the same | — | 2008-10-14 |
| 7346178 | Backplateless silicon microphone | Miao Yubo | 2008-03-18 |
| 7329933 | Silicon microphone with softly constrained diaphragm | Miao Yubo | 2008-02-12 |
| 7202552 | MEMS package using flexible substrates, and method thereof | Miao Yubo | 2007-04-10 |