Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5653020 | Method for forming plastic packages, in particular thin packages, for semiconductor electronic devices | Fulvio Tondelli | 1997-08-05 |
| 4887149 | Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink | — | 1989-12-12 |