Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5237485 | Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board | Bruno Murari | 1993-08-17 |
| 4711023 | Process for making single-in-line integrated electronic component | Giuseppe Marchisi | 1987-12-08 |
| 4712127 | High reliability metal and resin container for a semiconductor device | Piero Colombo, Marino Cellai | 1987-12-08 |