Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404209 | Electrical device package structure and manufacturing method thereof | Ching-Hohn Len, Hong-Zong Xu, Zhi-Xian Xu, Jie Zhu | 2022-08-02 |
| 9691735 | Miniaturized SMD diode package and process for producing the same | Ching-Hohn Lien, Xing-Xiang Huang, Hong-Zong Xu, Yi-Wei Chen | 2017-06-27 |
| 9691736 | Miniaturized SMD diode package and process for producing the same | Ching-Hohn Lien, Xing-Xiang Huang, Hong-Zong Xu, Yi-Wei Chen | 2017-06-27 |
| 9443825 | Multi-function miniaturized surface-mount device and process for producing the same | Ching-Hohn Lien, Xing-Xiang Huang, Jie Zhu, Hong-Zong Xu, Yi-Wei Chen +1 more | 2016-09-13 |
| 9165872 | Chip scale diode package no containing outer lead pins and process for producing the same | Ching-Hohn Lien, Xing-Xiang Huang, Hong-Zong Xu | 2015-10-20 |
| 6815519 | Acidic fluorine-containing poly (siloxane amideimide) silica hybrids | Yie-Shun Chiu, Te-Chuan Chang, Gaw-Pying Wang, Yaw-Shun Hong | 2004-11-09 |
| 6779458 | Method and apparatus for installing aft insulation in rocket motor case | Jun Fan | 2004-08-24 |