Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11807927 | Complex copper alloy including high-entropy alloy and method of manufacturing same | Eunsoo PARK, Jiyoung Kim, Jeongwon Yeh | 2023-11-07 |
| 11104976 | Bi-continuous composite of refractory alloy and copper and method for manufacturing the same | Il Hwan Kim, Hyun-Seok Oh, Sang Jun Kim, Eun Soo Park | 2021-08-31 |
| 10941463 | High-entropy alloy foam and manufacturing method for the foam | Eun Soo Park, Khurram Yaqoob, Je In Lee, Jin Yeon Kim | 2021-03-09 |
| 10538826 | Water-leachable alloy-melt-swapping process and porous metal manufactured using the same | Eunsoo PARK, Jein Lee, Wookha RYU, Geun Hee Yoo | 2020-01-21 |
| 10364487 | High entropy alloy having TWIP/TRIP property and manufacturing method for the same | Eun Soo Park, Hyun-Seok Oh, SangJun Kim, Chae Woo Ryu | 2019-07-30 |