Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11259415 | Method for discharging fluid | Hideki Nakamura, Toshihiko Mutsuji, Ryoichi Suzuki | 2022-02-22 |
| 10932372 | Fluid discharge device | Hideki Nakamura, Toshihiko Mutsuji, Ryoichi Suzuki | 2021-02-23 |
| 10632492 | Fluid discharge device, fluid discharge method, and fluid application device | Hideki Nakamura, Toshihiko Mutsuji, Kazuya Kitazawa | 2020-04-28 |
| 9511438 | Solder bump forming method and apparatus | Issaku Sato, Akira Takaguchi, Isamu Sato | 2016-12-06 |
| 9283686 | Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column | Shinichi Nomoto | 2016-03-15 |
| 6955285 | Apparatus for aligning and dispensing solder columns in an array | Shinichi Nomoto | 2005-10-18 |
| 5338008 | Solder reflow furnace | Tetsuya Okuno | 1994-08-16 |
| 5154338 | Solder reflow furnace | Tetsuya Okuno | 1992-10-13 |