Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6705509 | Method of recovering lead-free solder from printed circuit boards | Sakari Tada | 2004-03-16 |
| 6474537 | Soldering method using a Cu-containing lead-free alloy | Seiichiro Hasegawa | 2002-11-05 |
| 4740252 | Solder paste for electronic parts | Rikiya Kato | 1988-04-26 |