Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9669493 | Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component | Koji Watanabe, Minoru Toyoda, Satoshi Tomita, Tsutomu Sugino, Hiroki Oshima | 2017-06-06 |