TY

Tianlun Yang

S( Semiconductor Manufacturing International (Shanghai): 2 patents #301 of 1,122Top 30%
NI Ningbo Semiconductor International: 1 patents #19 of 29Top 70%
Overall (All Time): #1,439,666 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11130673 Packaging method and packaging structure 2021-09-28
9875965 Semiconductor device GuangCai Fu, Xiaoping Zhang 2018-01-23
9416004 Semiconductor device and fabrication method GuangCai Fu, Xiaoping Zhang 2016-08-16