Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9731960 | MEMS capping method | Lushan Jiang, Xiaojun Chen, Xuanjie Liu, Liangliang Guo | 2017-08-15 |
| 9640451 | Wafer bonding structures and wafer processing methods | Chao Zheng, Wei Wang | 2017-05-02 |
| 9620427 | Semiconductor device, related manufacturing method, and related electronic device | Chao Zheng, Liangliang Guo, Wei Wang | 2017-04-11 |
| 9352957 | Semiconductor device, related manufacturing method, and related electronic device | Chao Zheng, Liangliang Guo, Wei Wang | 2016-05-31 |
| 9290378 | MEMS capping method | Lushan Jiang, Xiaojun Chen, Xuanjie Liu, Liangliang Guo | 2016-03-22 |