TW

TsingChow Wang

S( Semiconductor Manufacturing International (Beijing): 2 patents #144 of 689Top 25%
Overall (All Time): #2,030,897 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9059004 Method for chip scale package and package structure thereof — 2015-06-16
8723319 BGA package structure and method for fabricating the same — 2014-05-13